Sept 10 (Reuters) – Chinese AI chipmakers including Huawei Technologies and Cambricon have sharply raised prices for current and next-generation AI processors, three people familiar with the matter said, as soaring costs for high-bandwidth memory squeeze efforts to build domestic alternatives to Nvidia.
Huawei has lifted the indicated price of its Ascend 950DT accelerator card, which integrates an AI processor with memory and other components, to above 250,000 yuan ($37,255), two people said.
The increase represents a jump of 20% to 50% from prices quoted to customers just two months ago, depending on contract terms, they said. Shenzhen-based Huawei has publicly said the 950DT, its most advanced AI chip, will be available in the fourth quarter of 2026.
Beijing-based Cambricon has also repriced its next-generation chip, tentatively called the 690, at 20% to 30% above levels it indicated two months ago, two sources said, without giving an exact figure. Smaller rivals MetaX and Iluvatar CoreX have made similar increases, the sources said.
The people declined to be identified because the pricing discussions are not public.
The price hikes illustrate how a worldwide shortage of high-bandwidth memory (HBM) is reverberating through China’s AI industry as Beijing presses companies to replace Nvidia products with home-grown alternatives.
HBM is a crucial component for AI computing, consisting of vertically stacked memory chips that allow processors to access vast amounts of data at high speeds. The advanced HBM market is dominated by South Korea’s SK Hynix and Samsung Electronics, and U.S.-based Micron Technology.
Since Washington tightened controls on exports of certain advanced HBM products to China in December 2024, Chinese chipmakers have increasingly relied on grey-market channels to secure supplies, the sources said.
Such HBM typically costs several times what buyers outside China pay, they said. Because memory accounts for a large share of an AI accelerator’s production cost, the higher prices are feeding directly into finished cards.
Huawei has said the Ascend 950 series will use two proprietary HBM technologies: HiBL 1.0 for the 950PR and HiZQ 2.0 for the 950DT, without detailing where or how the memory is manufactured.
The 950DT is built mainly for developing AI models and generating responses, while the 950PR processes user requests before they are passed to the model.
Huawei, Cambricon, MetaX and Iluvatar CoreX did not respond to requests for comment.
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